Through a development agreement with the city of Peoria, the municipality provided 50 acres at no cost to Amkor (Nasdaq: AMKR ...

NXP also plans to broaden its supply chain in mainland China, where it has a testing and packaging facility in Tianjin.

YES announced today that it is releasing the 3rd generation VertaCure curing systems for use in manufacturing advanced packaging solutions.

Lam Research has solid financial metrics, with impressive top line growth and long-term profitability, despite the recent ...

AKM will continue to leverage its proprietary compound semiconductor and packaging technology in order to further contribute ...

The customer previously ordered multiple SymCool® power modules and drivers. They are interested in SymCool® and SymCool® IQ modules for solid-state circuit protection and power conversion solutions ...

The US Department of Energy’s (DOE) Office of Electricity (OE) has announced the eight winners of the SiC Packaging Prize ...

NXP Semiconductors NV and a Taiwan Semiconductor Manufacturing Co. affiliate are discussing an expansion of their $7.8 ...

Occupants of a vehicle who confronted Secret Service near the home of Treasury Secretary Janet Yellen fled the scene after an ...

The US will launch its third crackdown in three years on China's semiconductor industry on Monday, restricting exports to 140 ...

Apple moves away from using TSMC's new 2nm process node for its next-gen M5 chip because of high costs, will use SoIC ...

On November 15, the U.S. Department of the Treasury published final regulations to implement its long-awaited “Outbound Investment” Security ...