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(LEAD) U.S. unveils new package of chip export controls against China
The United States on Monday announced a new semiconductor export control package against China, including curbs on high-end chips for artificial intelligence (AI) that are likely to affect the South Korean industry.
US hits China’s chip industry with new export controls
The US has introduced new export controls in an effort to curtail China’s ability to create an advanced semiconductor industry and to slow its development of artificial intelligence with military applications.
Latest US clampdown on China's chips hits semiconductor toolmakers
The US will launch its third crackdown in three years on China's semiconductor industry on Monday, restricting exports to 140 companies.
US unveils fresh export curbs targeting China's chip sector
The United States announced new export restrictions Monday targeting China's ability to make advanced semiconductors, drawing swift condemnation from Beijing as competition deepens between the world's two biggest economies.
U.S. unveils new package of chip export controls against China
The United States on Monday announced a new semiconductor export control package against China, including curbs on high-end chips for artificial intelligence that are likely to affect key South Korean manufacturers.
Latest US strike on China's chips hits semiconductor toolmakers
The United States on Monday launched its third crackdown in three years on China's semiconductor industry, curbing exports to 140 companies, including chip equipment maker Naura Technology Group, among other moves.
New US chip sanctions to hit Chinese tool makers, but Japan, Netherlands exempt
New US restrictions will hit two dozen semiconductor companies, two investment firms and over 100 chipmaking tool makers, sources told Reuters.
Compoundsemiconductor.net
2h
US DoE announces SiC packaging projects
The US Department of Energy’s (DOE) Office of Electricity (OE) has announced the eight winners of the SiC Packaging Prize ...
OKC Thunder Wire
13d
ASU awarded $100 million to improve the way semiconductors are packaged
A research team headed by Arizona State University has won a $100 million federal award to improve the way semiconductors are ...
Business Facilities
13d
CHIPS for America Gives U.S. Semiconductor Packaging A $300M Boost
Advanced substrates are physical platforms that allow multiple
semiconductor
chips to be assembled seamlessly together, ...
Semiconductor Engineering
13d
FOPLP Gains Traction in Advanced Semiconductor Packaging
Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable ...
2d
UP nod to 8.5k-cr package for Noida semiconductor projects
The Uttar Pradesh government has approved a massive incentive package of over ₹8,500 crore for two semiconductor ...
TMCnet
8h
YES announces release of VertaCure XP G3 Systems for Advanced Packaging Applications
YES announced today that it is releasing the 3rd generation VertaCure curing systems for use in manufacturing advanced ...
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