Dispensing solder paste onto one board is easy enough with a syringe or toothpick, but when pasting up even a handful of boards, this method gets tiresome. Solder paste stencils speed up the ...

Shenmao's PF606-P lead-free solder paste is designed specifically for the reverse hybrid assembly process, which uses SAC solder paste and BGA components with LTS balls.

[Jan Mrázek]’s success with 3D printing a solder paste stencil is awfully interesting, though he makes it clear that it is only a proof of concept. There are a lot of parts to this hack ...

SHENMAO America, Inc. is excited to introduce its Lead-Free Solder Paste PF606-P, designed specifically for the “Reverse Hybrid” assembly process. This new approach is revolutionizing board assembly ...